Key Features
- Automated process cycle minimises operator input
- Excellent wafer to support disc parallelism
- Touch button control of bonding parameters
- 102mm (4") or 152mm (6") wafer capacity
- Single or multiple wafer capacity
Description
Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP require delicate handling procedures.
It is necessary to maintain the highest quality of sample yield and minimize breakage of these expensive materials in the wafer preparation process.
The Logitech Wafer Substrate Bonding Units for temporary wax mounting of GaAs and silicon wafers have been designed to meet such stringent requirements. These machines complement Logitech's range of lapping and polishing systems and offer significant performance advantages over current products.
Available as a single station or a three station unit, this highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to mount and bond up to three part or whole wafers up to a diameter of either 102mm (4") or 152mm (6") prior to further processing. The system produces consistently high standards of wafer to disc support parallelism, irrespective of whether one large wafer or a number of small wafers of differing thickness are being mounted and bonded.
Touch button control of the process display on the machine's from panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.
Product Options
The WSB2 is available as a 220V, 50Hz Unit or as a 110V, 50/60Hz unit in addition to the following options:
- Single unit with pump
- Single unit with pump and 6" substrate capability
- Tripe unit with pump
- Triple unit with pump and 6" substrate capability
Product Specification
4" Version |
6" Version (Triple Only) |
|
| Power Requirements : | 0.72kW (240V)* 0.66kW (110V)* 1.4kW (240V)*** 1.44kW (110V)*** |
3.12kW (240V)*** |
| Water Supply Requirements : | Mains pressure cold water | Mains pressure cold water |
| Pressurised air (optional) : | Regulated to 2bar +/- 0.2bar maximum | Regulated to 2bar +/- 0.2bar maximum |
| Height : | 350mm (13.78") | 350mm (13.78")*** |
| Depth : | 580mm (22.83") | 580mm (22.83")*** |
| Length : | 520mm (20.47")* 960mm (37.80")*** |
1200mm (47.24")*** |
| Weight : | 31Kg (69lbs)* 57Kg (126lbs)*** |
117Kg (258lbs)*** |
* refers to single station unit
*** refers to triple station unit
For more information on the WSB2 Wafer Substrate Bonding Unit, call us on +44 (0)1389 875444 or complete our contact form.