Key Features
- Suitable for high and low temperature waxes
- Automatic shutdown at desired thickness
- Uniform density distribution of wax
- Automatic cycle for minimal supervision
- 102mm (4") or 152 (6") diameter
Description
The WCS-10 was developed to ensure precise and repeatable bonds, with the minimum of distortion, by depositing an even layer of wax across the wafer support substrate. Subsequent bonding is carried out with the Wafer Substrate Bonding Unit.
The production of thin and ultra-thin section wafers for laser diodes, focal plane arrays, MMIC's, IR detectors, etc. often requires precise mounting of the wafer on to a stable support material for subsequent back thinning or polishing. This ensures the integrity of the wafer and its geometric tolerances during processing.
Precise and repeatable wax bonds are paramount to achieving standard tolerances and traditional bonding methods are not consistent in thickness or bond quality. The objective is therefore to control the wax layer so that the wafer is:
- without taper after lapping and polishing
- of uniform thickness, i.e. there must be no air bubbles to distort the bond layer
- intact and in one piece, i.e. not cleaved or damaged due to bond deterioration during processing.
Product Options
The WCS-10 is available as a 240V/50Hz Unit or as a 110V/50-60Hz Unit and has the following configuration options:
- WCS-10 for use with 4" substrates
- WCS-10 for use with high melting point wax
- WCS-10 for use with 4" substrates and h.m.p wax
Product Specification
| Power Supply : | 220/240V, 50Hz or 110V, 50/60Hz |
| Max Capacity : | 6 wafers of 83mm (3") diameter 4 wafers of 105mm (4") diameter 1 wafer of 152mm (6") diameter |
| Height : | 1600mm |
| Depth : | 580mm |
| Width : | 940mm |
| Weight : | 200Kg (440lbs) |
| Water Supply : | Mains pressure cold water |
For more information on the WCS10 Wax Layer Coating System, call us on +44 (0)1389 875444 or complete our contact form.