Logitech Ltd - World Leaders in cutting, lapping and polishing equipment

English | 中文

Product Specification

Power Supply : 220V/240V, 50Hz (Single Phase)
Fuse Rating : 6A
Plate Speed : 10 - 100 rpm
Wafer Carrier Speed : 10 - 100 rpm
Wafer Back Pressure : 0 - 14 psi
Carrier Down Pressure : 0.4 - 9 psi
Plate Size : 400mm
Slurry Flow Rate : 20-500mls/min
Timer : 0-99 hours
Height : 1130mm
Depth : 730mm
Width : 935mm
Weight : 220Kg
360Kg (packed)

 

For more information on the Tribo Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our contact form.