Logitech Ltd - World Leaders in cutting, lapping and polishing equipment

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Product Specification

Power Supply : 240V, 10A single inlet
Fuse Rating : 10A
Plate Speed : 0 - 100 rpm
Wafer Carrier Speed : 0 - 100 rpm
Wafer Back Pressure : 0 - 50 psi / 344kPa
Carrier Down Pressure : 0.4 - 9 psi / 2.8kPa
Plate Size : 400mm
Slurry Flow Rate : 20-500mls/min
Timer : 0-99 hours
Height : 1123mm
Depth : 726mm
Width : 914mm
Weight : 225Kg
524Kg (packed)

 

For more information on the Tribo Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our contact form.