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Key Features
  • Superior wear resistance
  • Excellent Flatness Control
  • Suitable for all material types
The following items are available. Please enter required quantities and add to quote.
Note: If any items you require are currently out of stock, please contact us for further details.
ID Name SKU Summary Stock Price Quantity
5337 EP1 12" Diameter Plain - Pack of 5 0CON-399 Plain, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 12EP1P). Compatible with PM5 In stock Log in to view price
5341 EP1 12" Diameter Grooved - Pack of 5 0CON-398 Grooved, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 12EP1G). Compatible with PM5 In stock Log in to view price
5352 EP1 14" Diameter Plain - Pack of 5 0CON-401 Plain, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 14EP1P). Compatible with LP50 In stock Log in to view price
5353 EP1 14" Diameter Grooved - Pack of 5 0CON-400 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 14EP1G) Compatible with LP50 In stock Log in to view price
5354 EP1 16" Diameter plain - each 0CON-481 Plain, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 16EP1P) Compatible with Tribo In stock Log in to view price
5355 EP1 16" Diameter Grooved - each 0CON-482 Grooved, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 16EP1G) Compatible with Tribo In stock Log in to view price
5356 EP1 20" Diameter Plain - each 0CON-377 Plain, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 20EP1P) Compatible with CDP In stock Log in to view price
5357 EP1 20" Diameter Grooved - each 0CON-367 Grooved, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 20EP1G) Compatible with CDP In stock Log in to view price
5358 EP1 22" Diameter Grooved - each 0CON-370 Grooved, expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 22EP1G) Compatible with DP Series In stock Log in to view price
5359 EP1 24" Diameter plain -each 0CON-487 Plain expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 24EP1P). Compatible with Orbis In stock Log in to view price
5360 EP1 24" Diameter Grooved - each 0CON-488 Grooved, expanded Polyurethane, EP1-G 10mm X-Y Grooved Polishing Pad. Compatible with Orbis In stock Log in to view price
5361 EP1 28" Diameter Grooved - each 0CON-392 Grooved, expanded Polyurethane, EP1-G 10mm X-Y Grooved Polishing Pad. Compatible with CDP In stock Log in to view price
5362 EP2 12" Diameter plain - Pack of 5 0CON-387 Plain expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 12EP2P) Compatible with PM5 In stock Log in to view price
5363 EP2 12" Diameter Grooved - Pack of 5 0CON-386 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 12EP2G) Compatible with PM5 In stock Log in to view price
5364 EP2 14" Diameter plain - Pack of 5 0CON-389 Plain expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 14EP2P) Compatible with LP50 In stock Log in to view price
5365 EP2 14" Diameter Grooved - Pack of 5 0CON-388 Grooved Expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 14EP2G) Compatible with LP50 In stock Log in to view price
5366 EP2 16" Diameter plain - each 0CON-483 Plain expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 16EP2P) Compatible with Tribo In stock Log in to view price
5367 EP2 16" Diameter Grooved - each 0CON-484 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 16EP2G) Compatible with Tribo In stock Log in to view price
5368 EP2 22" Diameter Grooved - each 0CON-385 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 22EP2G) Compatible with DP Series In stock Log in to view price
5369 EP2 24" Diameter Plain - each 0CON-489 Plain expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing (Type 24EP2P) Compatible with Orbis In stock Log in to view price
5370 EP2 24" Diameter Grooved - each 0CON-490 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 24EP2G) Compatible with Orbis In stock Log in to view price
5371 EP2 28" Diameter Grooved - each 0CON-393 Grooved expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 28EP2G) Compatible with CDP In stock Log in to view price
Detailed product information
  • Detailed description
  • Applications

Logitech supply a range of polyutherane pads for optimum polishing results.  Our range of pads are suitable for various CMP applications, including; oxide, nitride and copper.

Logitech pads are compatable with Logitech PM5; LP50; DP; Orbis or Tribo systems.

 

EP1: Polyutherane Pads
These pads have a foamed elastometer structure with controlled cells.  This unique structure and high hardness improves planarity and is designed for optimum polishing of Silicon, Sapphire and optical materials.  The EP1 pads are supplied with a pressure sensitive adhesive backing for excellent flatness control. 

 

Product Data:

Pad Size Product Code: Finish  Pack Size  System Compatability Description
300mm (12") OCON-399  Plain 5 PM5 0.050" thick.  Shore A hardness 97.
300mm (12") OCON-398 Grooved  5 PM5 0.050" thick with 10mm XY grooving. Shore A hardness 97.
350mm (14") OCON-401 Plain  LP50 0.050" thick.  Shore A hardness 97.
350mm (14") OCON-400 Grooved  LP50 0.050" thick with 10mm XY grooving.  Shore A hardness 97.
400mm (16") OCON-481 Plain  Tribo 0.050" thick.  Shore A hardness 97.
400mm (16") OCON-482 Grooved  Tribo 0.050" thick with 10mm XY grooving.  Shore A hardness 97.
500mm (20") OCON-377 Plain  CDP  0.050" thick.  Shore A hardness 97.    
500mm (20") OCON-367 Grooved   1 CDP  0.050" thick with 10mm XY grooving.  Shore A hardness 97.
550mm (22") OCON-370 Grooved  DP Series 0.050" thick with 10mm XY grooving.  Shore A hardness 97. 
600mm (24") OCON-487 Plain 1 Orbis 0.050" thick.  Shore A hardness 97.
600mm (24") OCON-488 Grooved 1 Orbis 0.050" thick with 10mm XY grooving.  Shore A hardness 97.
700mm (28") OCON-392 Grooved 1 CDP 0.050" thick with 10mm XY grooving.  Shore A hardness 97.

 

EP2: Polyutherane Pads
These pads have a micro-cellular structure that enables it to act in a "sponge like" manner, while maintaining the hardness and flatness.  Pads are supplied with a pressure sensitive adhesive backing.  Excellent flatness control and fast polishing rates. 

 

Product Data:

Pad Size Product Code: Finish Pack Size Product Compatability  Description
300mm (12") OCON-387 Plain 5 PM5 0.050" thick.  Shore A hardness 86.
300mm (12") OCON-386 Grooved 5 PM5 0.050" thick with 10mm XY grooving. Shore A hardness 86.
350mm (14") OCON-389 Plain 5 LP50  0.050" thick.  Shore A hardness 86.
350mm (14") OCON-388 Grooved 5 LP50  0.050" thick with 10mm XY grooving. Shore A hardness 86.
400mm (16") OCON-483 Plain 1 Tribo  0.050" thick.  Shore A hardness 86.
400mm (16") OCON-484 Grooved 1 Tribo  0.050" thick with 10mm XY grooving.  Shore A hardness 86.
550mm (22") OCON-385 Grooved 1 DP Series  0.050" thick with 10mm XY grooving.  Shore A hardness 86.   
600mm (24") OCON-489 Plain 1 Orbis  0.050" thick. Shore A hardness 86.
600mm (24") OCON-490 Grooved 1 Orbis  0.050" thick with 10mm XY grooving.  Shore A hardness 86.
700mm (28") OCON-393 Grooved 1 CDP  0.050" thick with 10mm XY grooving.  Shore A hardness 86.

 

  • Semiconductors

    Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

     

    Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

     

    Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

     

    Semiconductor Applications
  • Optoelectronics

    Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

     

    Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

     

    Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

    Logitech Optoelectronic Material Processing Systems
  • Optics

    The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

     

    The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

    Systems for Optical Material Applications
  • CMP Applications

    Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results.  For example co-efficient of friction monitoring (CoF).

     

    The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

  • Geological Sciences

    In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock.  To be able to do this a thin section needs to be prepared for microscopic examination.

     

    Logitech precision equipment is ideal for thin or ultra-thin section preparation.  Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

     

    Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

    Geological Sciences Applications
  • Other Applications

    Logitech systems are used by organisations across the world for many different complex sample preparation processes. 

     

    Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.

    Logitech Material Processing Specialists