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Orbis Chemical Mechanical Polishing System

Product Specification

Power Supply : 1Phase + Neutral + Earth
  220Vac-240Vac, 25 Amps, 50/60Hz
Plate Speed : 0 - 160 rpm
Wafer Carrier Speed : 10 - 125 rpm
Wafer Back Pressure : 0 - 50 psi / 344kPa
Carrier Down Pressure : 0.4 - 9 psi / 62kPa
Plate Size : 600mm
Slurry Flow Rate : 20-500mls/min
Timer : 0-99 hours
Height : 1950mm
Depth : 781mm
Width : 1680mm
Weight : 501Kg
730Kg (packed)

 

For more information on the Orbis Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our product request form.