Product Specification
| Power Supply : | 220V, 50Hz (Single Phase) |
| Fuse Rating : | 13A |
| Plate Speed : | 10 - 160 rpm |
| Wafer Carrier Speed : | 10 - 130 rpm |
| Wafer Back Pressure : | 0 - 14 psi |
| Carrier Down Pressure : | 0.4 - 9 psi |
| Plate Size : | 600mm |
| Slurry Flow Rate : | 20-500mls/min |
| Timer : | 0-99 hours |
| Height : | 2500mm |
| Depth : | 730mm |
| Width : | 1600mm |
| Weight : | 501Kg 650Kg (packed) |
For more information on the Orbis Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our contact form.