Key Features
- Automatic lapping plate flatness control available
- 6"(152mm) wafer processing
- 22"(56cm) diameter plate capacity
- Four workstations
- Integral abrasive autofeed
Description
The LP600 provides production-based companies within the semiconductor and photonics industries with a high quality lapping and polishing facility, guaranteeing sample flatness, minimal taper and no sub-surface damage.
The abrasive autofeed system enables the operator to effectively control abrasive while lapping and polishing up to six inch diameter wafers, while a version of the LP600 is available that is resistant to sodium hypochlorite based polishing fluids, making it ideally suited for chemo-mechanical polishing processes.
With four workstations, eccentric sweep availability and a 56cm (22") diameter plate, the LP600 is capable of accommodating up to four PP5, PP6 or PP8 jigs, while the LP600auto will accommodate three PP5, PP6 or PP8 jigs.
When using the PP8 jigs with the LP600, the use of heavier loading weights and a more powerful processing plate motor has enabled the LP600 range of Logitech machines to provide the increased volumes required in a small batch lapping and polishing production environment.
Product Options
The LP600 is available in 220/240V, 50Hz and has the option of either a PP5 or PP6/PP8 jig configuration. In addition to these options, the LP600 is available with the following configurations:
Product Specification
| Power Supply : | 220/240V, 50Hz |
| Fuse Rating : | 10A |
| Plate Speed : | 1-100rpm |
| Timer : | 0 to 10 hours |
| Plate Size : | 560mm (22") |
| Height : | 1400mm (not including autofeed) 1467 (including autofeed) |
| Depth : | 720mm |
| Width : | 1120mm |
| Weight : | 430Kg |
| Plate weight : | 55Kg |
For more information on the LP600 lapping and polishing machine, call us on +44 (0)1389 875444 or complete our contact form.