Logitech已经开发出一系列精密的切割机以满足极高要求的切割，它们用于以下 材料等加工应用：
我们有外缘、内缘，切片，线切及盘片切割等一系列的切割设备，能够满足您的确切需求。
APD1 Precision Saw
The APD1 offers a unique combination of annular slicing and peripheral cutting capabilities in one precision saw. It may be programmed to make repeated cuts to selected thickness automatically with a minimum of surface damage and kerf loss.
APD2 Precision Saw
The APD2 is ideal for both research and production purposes. It is available in either annular or peripheral modes, both featuring unattended operation. The APD2 can cut wafer boules of up to 78mm in diameter with high positional accuracy and minimal material waste.
AWS1 Abrasive Wire Saw
The AWS1 Abrasive Wire Saw allows fragile or difficult materials to be cut or watered without fear of the samples becoming damaged.
AXL1 Precision Annular Saw
This saw is designed for the fine cutting of a wide range of hard and friable materials. It is ideal for producing precise cuts and quality surface finish with minimal kerf loss.
Model 15 Diamond Wire and Disc Saw
The Model 15 Saw incorporates easily interchangeable wire and disc cutting heads to provide a single saw for all applications. The cutting action of diamond discs is particularly effective on electro-optic materials when greater loads may be used.
GTS1 Thin Section Cut-Off and Trim Saw
Geological Trim Saw, for initial trimming of bulk specimens and thinning of up to twelve 28x48mm slide-mounted specimens.
CS30
Geological Trim Saw, for initial trimming of bulk specimens and thinning of two 28x48mm slide-mounted specimens.
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