Logitech's CMP抛光系统 是一种多用途化学抛光机械，它专门设计用于那些对几何精确度和表面质量要求严格的抛光应用。
我们的化学机械抛光系统解决方案可以达到纳米级材料去除，既可对单个模具进行纳米级的精确抛光，也可对直径大至12英寸的薄片进行抛光，可用于当今器件制造工艺中的诸多晶片及衬底材料的抛光。请访问 CMP相关知识.
Orbis Chemical Mechanical Polishing System
The Orbis has been designed specifically as a pilot production Chemical Mechanical Polishing system. It is ideally suited for R&D environments where testing or developing new processes would otherwise require the use of expensive production oriented tools.
Tribo Chemical Mechanical Polishing System
The Tribo is a benchtop Chemical Mechanical Polishing machine capable of processing full or part wafers up to 4" (100mm) in diameter. It is supplied with a range of process data collection options offering in-depth analytical tools and allow for greater versatility and flexibility.
需要更多关于化学机械抛光系统的信息，请至电 +86 (10)62564811，62538157或者填写我们的联系表格.