Corresponding to each of the steps involved in thin section preparation, Logitech supplies appropriate equipment to give high quality results (uniform thickness, no crystal plucking or shattering, minimal intergranular relief etc) within the optimum timeframe by removing the tedious and time consuming hand lapping stages.
Depending on your requirements, we offer thin section lapping and polishing equipment catering for a wide range of capacities and throughput.
One of the benefits of Logitech thin section lapping and polishing equipment is our unique undercut process. This allows for soft or friable thin sections such as soil or impregnated coal to be processed with very little damage, resulting in even higher quality samples being produced.
Lapping
The PM5 Lapping and Polishing Machine (1 workstation) or the LP50 Lapping and Polishing Machine (3 workstations) form the basis of most thin section preparation systems. The PM5 auto-lap and LP50 auto offer the important additional benefit of automatic lapping plate flatness control. The CL50 lapping machine is supplied as standard with the Compact 50 Thin Section system for smaller scale operations.
Polishing
The WG2 polishing system is compatible with one model in each of the PM5 base systems. It uses an independently rotating polishing head which both reduces overall polishing time and enhances the quality of the finished sample. The WG3 polishing head for the Compact 50 polishing system has a similar function but is suited to smaller scale operations.
Low Volume Thin Section Preparation Systems
C50 Polishing System
The Compact 50 Polishing System provides the ideal solution to the problems of obtaining high quality polished thin sections with the minimum of capital investment. The system comprises the CP50 polishing machine and the WG4 motor-driven polishing head.
PM5 Auto-Lap Precision Lapping Machine
The PM5 auto-lap is a 300mm diameter single-workstation lapping machine, with the unique ability to automatically maintain the flatness of the lapping plate surface.
PM5 Auto-Pol Precision Lapping Machine
The PM5 Auto-Pol offers a revolutionary approach to flat polishing. Its microelectronics offer the highest level of automated control, reducing processing time without sacrificing polishing plate flatness.
PM5 Precision Lapping Machine
The PM5 range is a new generation of single-workstation precision lapping and polishing machines offering significant refinements and benefits for all materials processing applications. It accepts 300mm diamter lapping and polishing plates.
WG2 Polishing System
The WG2 Geological Thin Section Polishing System, comprised of a PM5(w) Precision Polishing machine and WG2 Polishing head, offers the best quality surface finish, the fastest possible production rates and the most economic operation.
Medium Volume Thin Section Preparation Systems
LP50 Auto Precision Lapping and Polishing Machine
The LP50 auto-lap is a 350mm diameter bench-top lapping machine, with the unique ability to automatically maintain the flatness of the lapping plate surface.
LP50 Precision Lapping and Polishing Machine
The LP50 is a multi-workstation lapping and polishing machine that accepts 350mm lapping and polishing plates.
High Volume Thin Section Preparation Systems
LP600 Precision Lapping and Polishing Machine
The LP600 provides production-based companies with a high quality lapping and polishing facility, guaranteeing sample flatness, minimal taper and no sub-surface damage.
For more information on our geological thin section lapping and polishing equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.