Bonding techniques for processing geological thin section and other materials require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimise breakage of the materials in the preparation process.
As a result of over 35 years experience in materials processing, we have developed thin section bonding equipment that will give superior, bubble free bonds - time after time.
BJ Bonding Jigs
A range of mechnaical bonding jigs to improve epoxy and wax bonding uniformity. "Zero bonding" and "controlled thickness bonding" are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
For more information on our thin section bonding equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.