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Logitech Ltd - World Leaders in cutting, lapping and polishing equipment

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OptoElectronics

OptoElectronics materials processing

Recent advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as:

  • Dense Wavelength Division Multiplexing (DWDM)
  • Optical isolators
  • Signal processors
  • Optical switching

One of the major requirements in the production of these optoelectronics devices is the preparation of a substrate which is of precise geometric tolerances and has a very high degree of surface polish. These devices are normally based on substrates made from materials such as Lithium Niobate, Sapphire, Lithium Tantalate, Potassium Titanyl Phosphate and Beta Barium Borate.

A Logitech optoelectronic materials processing system offers the ideal solution to the problems encountered in producing substrates which satisfy the stringent criteria for device manufacture. They provide facilities for initial cutting of material into components of a suitable size, smooth lapping of main and edge faces to generate initial component geometry, and final polishing to full performance specification.

Typical results produced are:

  • defect free and edge polishing of substrates
  • scratch free surface finish on all material types
  • exacting and repeatable dimensional results

Specifically designed to cater for each individual's needs, our optoelectronics processing solutions offer full adaptability to a range of different requirements and material types, complete dependability of results and a variable throughput capacity - capable of being tailored to suit both research and production facilities.

Selection from the following key system components will satisft every conceivable integrated optical materials processing requirement:

Wafer Slicing Annular saws, such as the APD1 and APD2, are ideal for slicing wafers from the boule (up to 78mm diameter) and are capable of cutting slices as thin as 0.1mm. Kerf loss is very low so there is no unnecessary wastage and surface roughness can be of the order of 200nm depending on the material being cut. Read more about crystal and wafer dicing

Lapping & Polishing High speed polishing systems for both production and research environments are available with the DH600 and DH300 respectively. These units provide the ideal solution to those seeking to polish optoelectronic materials such as silicon carbide or sapphire as process times can be cut by up to 50% through the driven head technology used. Read more about lapping and polishing

Crystal and Wafer Dicing Producing 'blanks' for optoelectronic device manufacturing requires that wafers are sawn into planks of the appropriate size. The APD1 and APD2 precision saws are able to carry out this process when suppied as peripheral saws, with a diamond disk replacing the saw's annular blade. For more delicate sawing, the Model 15 or AWS1 Abrasive Wire Saw can be used with crystal opientation being achieved using a 3 axis goniometer. Read more about this

Lapping and Polishing Plates As the range of optoelectronic material types used in extremely diverse and the surface requirements are stringent, correct choice of lapping and polishing plates is critical to obtaining high quality results. Logitech is uniquely placed to provide detailed advice on plate selection and offers a highly comprehensive range of plate types.

For more information on our optoelectronic equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.