Key Features
- Driven head technology dramatically
reduces polishing time for hard materials - Intuitive control panel provides easy access
to range of system features & parameters - Industry standard protocols provides for
improved health & safety features - Automated process recipes increase system
flexibility, repeatability and usability
Description
The Logitech DP1 is a high speed polishing system designed primarily to process hard materials, such as sapphire, silicon carbide or gallium nitride, to epitaxy ready quality surfaces.
It can process material up to 12”/300mm Ø (or multiple smaller samples) and its’ driven head technology is capable of applying up to 200Kg of download on the carrier head, dramatically reducing processing times.
Materials such a sapphire, silicon carbide (SiC) and gallium nitride (GaN) are notoriously difficult to polish due to their hard and inert nature. The solution to this problem comes in the shape of the DP1. With its built-in compression polishing technology, the DP1 can generate up to 200Kg of back side pressure, dramatically reducing processing times from anywhere between 70-400% over more traditional methods.
Chemical based polishing processes are also catered for, as all parts and components are sodium hypochlorite resistant. To ensure the correct mix of polishing fluid is supplied, the DL1 incorporates a magnetic stirrer to ensure NaOCl based slurries are kept in constant suspension, while an internal peristaltic pump delivers this slurry to the processing pad.
The DP1 incorporates a 10.4” touch screen interface running NI Labview software. The custom control panel provides operators with a range of advanced benefi ts in terms of ease of use and flexibility.
Additionally, the latest version of our intuitive interface now displays even more useful information, such as plate motor load and speed, as well as pressure feedback from the regulator. This data allows process parameters and individual variables to be analyzed in order to maximise results.
Typical Applications
The DP1 caters specifically for the high speed, automated final stage polishing of wafered optical, photonic or semiconductor materials such as sapphire, silicon carbide (SiC), or gallium nitride (GaN). Filters, wedges, flats or even small LCD panels can be polished to high accuracy and within vastly reduced time frames.
The single station makes it ideal for low production processes or research and development purposes and, while it specializes in processing hard materials, its’ versatility ensures it can work with virtually any optical or semiconductor material.
Product Specification
| Power Supply : | 240V 13A Single Inlet |
| Fuse Rating : | 10A |
| Plate Speed : | 160rpm |
| Plate Size : | 560mm (22") |
| Plate Rotation : | Clockwise & Counter Clockwise |
| Carrier Speed : | 10-125rpm |
| Height : | 2200mm (79.5") |
| Depth : | 1010mm* (41.3") |
| Width : | 725mm* (28.5") |
| Packed Weight : | 550Kg |
| Machine Weight : | 420Kg |
| Polishing Plate Weight : | 32Kg |
| Max. Slurry flow rate : | 500ml/min |
| Min. Slurry flow rate : | 20ml/min |
For more information on the DP1 Polishing Machine, call us on +44 (0)1389 875444 or complete our contact form.