Key Features
- Driven head technology allows for high
geometric accuracy - Process up to 32 x 50mm / 2” Ø wafers or 4
x 200mm / 8” Ø wafers per run - Automatic parallelism
- Automated process recipes increase system
flexibility, repeatability and usability
Production Volume Throughput
The Logitech DL4 is a lapping system capable of processing material with high geometric precision. It can handle up to four 200mm / 8” Ø wafers simultaneously - making it ideal for production environments.
It utilises motor driven jig technology to ensure consistent sample rotation during the processing, providing accurate and even material removal across the sample surface.
Due to it’s four independant 8" processing heads, the DL4 can simultaneously lap up to 32 x 50mm / 2” Ø wafers or samples. This makes it ideally suited to production environments or applications where high volume throughput is required. Furthermore, the lapping carrier is motor driven which ensures consistent sample rotation during processing. This results in high sample quality as the plate and abrasive slurry removes the material evenly.
Flexible Abrasive Feed Systems
The DL4 Machine features a very flexible abrasive feed system which uses easily removable and interchangeable 4.5 litre drums. Flow rate is controlled and can be set through the system interface.
Increased Accuracy
Material removal can be monitored and controlled to micron levels of accuracy, with real time monitoring available through the control panel.
User Friendly Interface
The DL4’s advanced user interface, accessed via a 10.4” LCD touch screen running the industry standard NI Labview software, has been designed to provide as much flexibility as possible. Graphical representation of key parameters displayed during processing offers monitoring and real-time analysis. To facilitate control flexibility, the system supports manual and automatic modes.
The manual mode provides access to individual process variables, thereby allowing operators to have extremely close control over process parameters. The automatic mode allows for complex recipes to be created and stored in memory. This provides the operator with the ability to build a recipe library, automate the lapping process and free up time to work on other tasks, safe in the knowledge that the samples will be processed to the required specification.
Industry Standard System Architecture
Safety features include industry standard door interlocks to the deck and lower cabinet areas, which protect operators from moving/electrical parts and the work area from accidental interruptions.
The DL4 is supplied with a full enclosure which has an exhaust port to allow an extract connection to be fitted if required. This ensures it is suitable for processing hazardous materials such as Gallium Arsenide (GaAs) or Indium Phosphide (InP).
Product Specification
| Power Supply : | 400Vac - 500Vac, 3 Phase 25A per Phase |
| Plate Speed : | 0 -100rpm |
| Plate Size : | 700mm (27.6") |
| Carrier Speed : | 10 - 60rpm |
| Min Slurry Flow Rate | 20ml/min |
| Max Slurry Flow Rate : | 500ml/min |
| Machine Capacity : | 32 x 2" wafers or 4 x 8" per run |
| Height : | 2020mm |
| Depth : | 1500mm |
| Width : | 1140mm |
For more information on the DL4 Lapping Machine, call us on +44 (0)1389 875444 or complete our contact form.