Mit über 40-jähriger Erfahrung in der Bearbeitung zahlreicher Materialien kommt es nicht von ungefähr, dass Logitech Systemlösungen für alle Anwendungsbereiche des Läppens und Polierens anbietet.
In forschungs- und designorientierten Anwendungsbereichen haben wir Systeme wie die Compact 50, PM5 und LP50 entwickelt, um dem Bearbeitungsbedarf im kleineren Umfang gerecht zu werden.
Für eher produktionsorientierte Läpp- und Polieranwendungen wurden die LP600, DH600 und NGS entwickelt, um höheren Durchsatz und größere Proben zu bearbeiten
NGS Next Generation System
The NGS is a 4 station production line system for the semiconductor and opto-electronics industries where there is a requirement for high yields and faster throughput, without compromise.
LP600 Precision Lapping and Polishing Machine
The LP600 provides production-based companies with a high quality lapping and polishing facility, guaranteeing sample flatness, minimal taper and no sub-surface damage.
LP50 Auto Precision Lapping and Polishing Machine
The LP50 auto-lap is a 350mm diameter bench-top lapping machine, with the unique ability to automatically maintain the flatness of the lapping plate surface.
LP50 Precision Lapping and Polishing Machine
The LP50 is a multi-workstation lapping and polishing machine that accepts 350mm lapping and polishing plates.
PM5 Auto-Lap Precision Lapping Machine
The PM5 auto-lap is a 300mm diameter single-workstation lapping machine, with the unique ability to automatically maintain the flatness of the lapping plate surface.
PM5 Precision Lapping Machine
The PM5 range is a new generation of single-workstation precision lapping and polishing machines offering significant refinements and benefits for all materials processing applications. It accepts 300mm diamter lapping and polishing plates.
Compact 50 Polishing System
The Compact 50 Polishing System provides the ideal solution to the problems of obtaining high quality polished thin sections with the minimum of capital investment. The system comprises the CP50 polishing machine and the WG4 motor-driven polishing head.
WG2 Polishing System
The WG2 Geological Thin Section Polishing System, comprised of a PM5(w) Precision Polishing machine and WG2 Polishing head, offers the best quality surface finish, the fastest possible production rates and the most economic operation.
Compact 50 Lapping System
The CL50 Compact Lapping Machine is a robust machine designed specifically to meet the requirements of the low volume producer of thin sections.
Orbis Chemical Mechanical Polishing System
The Orbis has been designed specifically as a pilot production Chemical Mechanical Polishing system. It is ideally suited for R&D environments where testing or developing new processes would otherwise require the use of expensive production oriented tools.
Tribo Chemical Mechanical Polishing System
The Tribo is a benchtop Chemical Mechanical Polishing machine capable of processing full or part wafers up to 4" (100mm) in diameter. It is supplied with a range of process data collection options offering in-depth analytical tools and allow for greater versatility and flexibility.
DL1 Precision lapping and Polishing Machine
The Logitech DL1 precision lapping and polishing system allows samples up to 200mm/8” Ø (or multiple smaller samples) to be processed with high geometric accuracy, while the driven jig polishing functionality can process samples at a high speed.
DP1 Precision Polishing Machine
The Logitech DP1 is a high speed polishing system designed primarily to process hard materials, such as sapphire, silicon carbide or gallium nitride, to epitaxy ready quality surfaces.
DL4 Lapping & Machine
The Logitech DL4 is a lapping and polishing system capable of processing material with high geometric precision, and handles up to four 200mm / 8” Ø wafers simultaneously - making it ideal for production environments.
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