Logitech have developed a series of precision saws to meet the extremely diverse requirements in a wide range of materials processing application areas such as:
With annular, peripheral, cut-off, wire and disk saws available in the range, we are confident that there is a precision saw to meet your exact requirements.
APD1 Precision Saw
The APD1 offers a unique combination of annular slicing and peripheral cutting capabilities in one precision saw. It may be programmed to make repeated cuts to selected thickness automatically with a minimum of surface damage and kerf loss.
APD2 Precision Saw
The APD2 is ideal for both research and production purposes. It is available in either annular or peripheral modes, both featuring unattended operation. The APD2 can cut wafer boules of up to 78mm in diameter with high positional accuracy and minimal material waste.
AWS1 Abrasive Wire Saw
The AWS1 Abrasive Wire Saw allows fragile or difficult materials to be cut or watered without fear of the samples becoming damaged.
AXL1 Precision Annular Saw
This saw is designed for the fine cutting of a wide range of hard and friable materials. It is ideal for producing precise cuts and quality surface finish with minimal kerf loss.
Model 15 Diamond Wire and Disc Saw
The Model 15 Saw incorporates easily interchangeable wire and disc cutting heads to provide a single saw for all applications. The cutting action of diamond discs is particularly effective on electro-optic materials when greater loads may be used.
GTS1 Thin Section Cut-Off and Trim Saw
Geological Trim Saw, for initial trimming of bulk specimens and thinning of up to twelve 28x48mm slide-mounted specimens.
CS30
Geological Trim Saw, for initial trimming of bulk specimens and thinning of two 28x48mm slide-mounted specimens.
For more information on our precision cutting and sawing machines and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.