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CP3000 Chemical Polishing Machine

CP3000 Chemical Polishing Machine

Key Features

  • Minimum subsurface damage
  • Maximum sample size - 200mm (8") diameter
  • Robustly constructed from corrosion resistant materials
  • Convenient, remote membrance touch panel control
  • Fine etch polishing of semiconductor wafers and electro-optic crystals

Description

This system has been specifically designed for use within an existing fume cabinet and has a maximum sample capacity - 3 off 114mm (4.5") diameter.

Fine prime face polishing of semi-conductor wafers and other electronic and opto-electronic crystals to give minimal subsurface damage often requires the use of a final etch polishing process.

The chemicals used in these processes, such as Bromine Methanol, Peroxide Alkaline or acid etches, are highly aggressive, and require the use of corrosion resistant equipment which is specifically designed for the purpose and which incorporates appropriate safety features.

As well as being compatible with such aggressive polishing media, the CP3000 can also be used for less aggressive Chemlox polishing e.g. for the back-side of semiconductor wafers.

Product Options

The CP3000 is available as 220V/50Hz or 110V/50-60Hz. There are two set up configurations for the CP3000: - CP3000 standard with remote control unit, feed unit and drain tank - CP3000 with eccentric drive, remote control unit, drain tank, polishing fluid feed with optional abrasive autofeed system.

Product Specification

Power Supply : 220V/240V, 50Hz or 110V, 50/60Hz
Main Drive Unit : 400x435x260mm
Remote Control Unit : 500x245x195mm
Max Height with Feed Unit : 660mm
Plate Diameter : 356mm (14")
Max Sample Size : 1 off - 8" ø
3 off - 4.5" ø
Plate Rotation : 0-70rpm
Weight : 42Kg

 

For more information on the CP3000 Chemical Polishing Machine, call us on +44 (0)1389 875444 or complete our contact form.