New AWS1 Saw offering high cutting and lapping performance

The new Logitech AWS1 Wire Saw allows fragile and expensive materials to be cut or wafered economically and without fear of the sample becoming damaged.

Designed primarily for use in photonics, semiconductor, electro-optic and geological applications, it uses fine lapping and cutting technology to perform cuts not only with a high surface quality but also with minimal material loss, minimal bow, and minimal sample damage.

The AWS1 follows on from earlier, successful Logitech wire saws, but enables operators to work with a more diverse range of sample materials at greater dimensions than was previously possible. The saw will slice samples up to 102mm (4") in diameter with a maximum boule/sample length of 102mm (4"). The accuracy and control offered by the AWS1 mean that expensive materials, such as Cadmium Zinc Telluride or YAG laser rods, can be cut more economically than in alternative sawing methods.