对于处理薄的和易碎的 II-VI 和 III-V族半导体晶片，地质薄片及其它材料，其相应的粘结技术需要精密的处理步骤。实验室粘结这些材料需要保持样品生产的最高质量以及将处理过程中材料的破损降到最低。
Logitech公司已经开发出多种粘结系统来满足这种要求。
WSB2 Wafer Substrate Bonding Unit
This highly automated machine is designed for wax-mounting of semiconductor wafers to a quartz or sapphire support disc. The bonding process -- evacuation of the chamber, heating, pressure bonding and cooling -- can be completed automatically by the machine in 45 minutes, depending on the temperature.
BJ Bonding Jigs
A range of mechnaical bonding jigs to improve epoxy and wax bonding uniformity. "Zero bonding" and "controlled thickness bonding" are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
WSB300 Wafer Substrate Bonding Unit
The WSB300 allows operators to bond materials and wafers up to 300mm (12") in diameter to the same exacting standards achieved by the Logitech bench-top systems.
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