Ultra-pure water treated by the Wet Bench helps prevent slurry crystallisation 
Key Features
- Real time monitoring of the polishing operation
- Custom designed software monitors main drive parameters
- Prevents need to halt planarization process to measure sample thickness
- Compatible with all version of CDP
Description
The EPD (End Point Detection) system allows real time monitoring of the polishing operation without any measurement downtime and is available as an optional addition to both the manual and automated versions of the CDP Chemical Delayering and Polishing system.
Operation
The CDPScan software communicates with the CDP unit through a PC or laptop running on Microsoft Windows 2000. The Windows style screens are easy to follow and show the progress of the planarization process through a series of real time graphs. Each graph depicts one of the process parameters listed above and is calculated using a set of pre-fixed algorithms. This allows the CDPScan software to monitor the polishing process, graphically plotting the condition of each parameter throughout the polishing process. Once the preset process parameters have attained their calculated end point the polishing process is complete.
In addition CDPScan can be used as a safety feature. Should any change be detected in any one of the monitored process parameters, CDPScan will trigger an audio alarm to help prevent over polishing occuring to the material being polished.
This safety feature might be triggered for instance should the carrier current speed change from its preset value. Such an event would signify that the polishing interface between the wafer / IC / die and the polishing pad had changed. Thus creating either an increase or decrease in the friction required to successfully planarize the material(s) being processed. Once the alarm is triggered the process parameter that has changed from the preset algorithm can be identified.
Automated control panel option
In automated CDP system control panels, any divergence from the preset process parameters during planarization / delayering will lead to the program being interrupted. The control panel will automatically move the process to the polishing end stage where the polishing pad is flushed with DI water and the wafer / IC / die carrier is lifted from the pad.
Retro-fitting the EPD system
All CDP systems are fully compatible with this system and can be retro-fitted with the appropriate software and hardware plug ins. Full training in the use of this system with the CDP unit is also available.
Product Options
This product does not have any options available.
Product Specification
| Plate Speed : | 0-480Hz, 1Hz resolution |
| Plate Current : | 0-400A, 1A resolution |
| Carrier Speed : | 0-480Hz, 1Hz resolution |
| Carrier Current : | 0-400A, 1A resolution |
| Plate Main Voltage : | 0-1000V, 1Hz resolution |
| DC-BUS Voltage : | 0-1000V, 1Hz resolution |
For more information on the CDP End Point Detection, call us on +44 (0)1389 875444 or complete our contact form.