Logitech have made available a wide range of semicon application notes in order for you to gain a deeper understanding of the technologies involved in working with certain materials and applications.
Each application note details process requirements, methodologies and system specifications required in order to process a sample to its optimum geometric control. Simply select one of the following documents, complete our short form and we will send the literature to you either by email or post.
|
6inch GaAs Wafer Backthinning |
| The semiconductor industry has consistently moved towards larger GaAs wafer sizes in an attempt to drive down the production cost per millimetre. This has seen a demand for processing equipment capable of working with wafer sizes up to six inches in diameter. Logitech has developed such a system and this Application Note gives details of the process and of the system. |
|
Delayering & Planarisation |
| The delayering of ICs and wafer planarisation are polishing processes that can create a number of difficulties. This Application Notes details how the use of a Logitech system can overcome any inherent difficulties when working with these applications. |
|
DWDM Processes |
| Dense Wavelength Division Multi-plexing (DWDM) is a fibre optic transmission technology that employs light wavelengths to transmit data parallel-by-bit or serial-by-character. It is a key enabling technology used in optical networking systems and provides dramatic capacity increases combining multiple tightly controlled wavelengths of laser onto a single fibre path. |
|
IC Failure Analysis |
| As Integrated Circuits become ever more complex and densely packed, it is essential that IC manufacturers develop improved device failure analysis techniques. Logitech recognise this need and have developed two distinct processes for the purpose of both highlighting and analysing defects in either whole wafers or single ICs. |
|
MEMS Device Processing |
| MEMS, or Micro Electro Mechanical Systems, are becoming increasingly popular. Used commercially as miniature sensors, controllers or actuators, MEMS devices prevent cumbersome electrical components from being used since the electronics are placed directly onto the devices themselves. |
|
Polishing Silicon Carbide Substrates |
| Silicon Carbide is emerging as one of the most useful of the wide band gap semiconductor materials. Its high thermal conductivity and melting point make it an excellent substrate for high power amplifier devices, such as television transmitters. This application note details how Logitech equipment can be applied to achieve precision processing of this material. |
|
Processing CVD Diamond |
| The use of thin film diamond for 'heat sink' electronic and opto-electronic applications in the semiconductor manufacturing industry has slowly increased over the last few years. Logitech has invested significant development time on this application and as a result is able to offer a complete lapping and polishing system package which is specifically suited to polishing CVD Diamond. |
|
Silicon on Silicon |
| Many research and production facilities are increasingly seeking successful methods of thinning down the top wafer of a two wafer fusion bonded assembly to achieve a final thickness as low as 2 microns.
Logitech has responded to this need by developing a system to suit this demanding application. |
