Our team of experts will work with you to integrate the relevant processes and systems into your thin or ultra thin wafer fabrication programme. Initial discussions provide a detailed understanding of production quantity, wafer thickness, surface finish and geometric tolerance requirements.
Having over 45 years experience in design and manufacture of high precision equipment and in sophisticated materials processing, we provide a quick and effective route to complete success in any device fabrication process.
Our systems are typically used in the processing of:
A Logitech system for semiconductor wafers and devices would typically include: