Semiconductors

Our team of experts will work with you to integrate the relevant processes and systems into your thin or ultra thin wafer fabrication programme.  Initial discussions provide a detailed understanding of production quantity, wafer thickness, surface finish and geometric tolerance requirements.

Having over 45 years experience in design and manufacture of high precision equipment and in sophisticated materials processing, we provide a quick and effective route to complete success in any device fabrication process.

A Logitech system for semiconductor wafers and devices would typically include:

• Wafer-support disc bonding of low, medium or high precision
• Jig controlled lapping and polishing using single or multi-workstation machines
• Mild Chemical Mechanical Processing (CMP) or aggressive chemical etch polishing within a controlled environment
• CMP processing using a dedicated system, such as a Logitech Tribo or Orbis system
• Gauging and inspection facilities to suit the required end result.