Logitech also has bench top bonding equipment available
Key Features
- Automated process cycle minimises operator input
- Excellent wafer to support disc parallelism
- Touch button control of bonding parameters
- 300mm (12") wafer capacity
- Single or multiple wafer capacity
Description
Want to bond materials and wafers up to 12" in diameter but are not willing to forego quality? The Logitech WSB300 Wafer Substrate Bonding Unit has been designed for use in laboratories where there is a need to bond wafers up to 300mm in diameter yet want to retain the highest quality of wafer / component yield whilst minimizing breakage / cleavage of these highly expensive wafers.
Available as a single station unit or with the ability to 'daisy chain' with other machines, the WSB300 incorporates vacuum, pressure and resin bonding facilities. It allows the operator to mount and bond a single wafer onto a glass substrate prior to further processing. Imagine being able to control a group of unites all at one from one control panel - say goodbye to setting up each machine individually!
The elimination of cleavage of ultra-thin wafers, repeatability of bond thickness and production of excellent dimensional accuracy are achieved through precise control of the flexible diaphragm within the bonding chamber of the WSB300 Wafer Substrate Bonding Unit - allowing you to concentrate on the more intricate aspect of the process.
Available as a single station or a three station unit, this highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to mount and bond up to three part or whole wafers up to a diameter of either 102mm (4") or 152mm (6") prior to further processing. The system produces consistently high standards of wafer to disc support parallelism, irrespective of whether one large wafer or a number of small wafers of differing thickness are being mounted and bonded.
Touch button control of the process display on the machine's from panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.
Product Options
The WSB300 is available as a 220V, 50Hz Unit
Product Specification
| Power Requirements : | 0.72kW (220V) |
| Water Supply Requirements : | Mains pressure cold water |
| Pressurised air (optional) : | Regulated to 2bar +/- 0.2bar maximum |
| Height : | 1690mm |
| Depth : | 635mm |
| Length : | 900mm |
| Weight : | 130Kg |
For more information on the WSB300 Wafer Substrate Bonding Unit, call us on +44 (0)1389 875444 or complete our contact form.