Key Features
- Driven head technology allows for high
geometric accuracy - Process up to 40 x 50mm / 2” Ø wafers or 4
x 200mm / 8” Ø wafers per run - Automatic parallelism
- Automated process recipes increase system
flexibility, repeatability and usability
Production Volume Throughput
The Logitech DL4 is a lapping and polishing system capable of processing material with high geometric precision, and handles up to four 200mm / 8” Ø wafers simultaneously - making it ideal for production environments.
It utilises motor driven jig technology to ensure consistent sample rotation during the processing, providing accurate and even material removal across the sample surface.
Due to it’s four independant processing heads, the DL4 can simultaneously lap up to 40 x 50mm / 2” Ø wafers or samples. This makes it ideally suited to production environments or applications where high volume throughput is required. Furthermore, the lapping carrier is motor driven which ensures consistent sample rotation during processing. This results in high sample quality as the plate and abrasive slurries remove the material evenly.
Once the material thickness has been reduced to the required specification, the system can be switched to a polishing configuration, where up to 8Kg can be brought to bear on the sample to process it to the final surface requirements, safe in the knowledge that the back thinning or delayering geometrics will remain true to the original specification.
Advanced Abrasive Feed Systems
Chemical based polishing processes are also catered for, as all parts and components are sodium hypochlorite resistant. To ensure the correct mix of polishing fluid is supplied, the DL4 incorporates a magnetic stirrer to ensure NaOCl based slurries are kept in constant suspension, while an internal peristaltic pump delivers this slurry to the processing pad.
Increased Accuracy
Accuracy of material removed to within 1μm is ensured with the DL4’s new, easy to read digital gauge incorporated into the lapping and polishing jig. As material is removed, the amount is shown in real-time on the display. This makes it easy for operators to ensure samples are not over-processed.
User Friendly Interface
The DL4’s advanced user interface, accessed via a 10.4” LCD touch screen running the industry standard NI Labview software, has been designed to provide as much flexibility as possible. Graphical representation of key parameters displayed during processing offers improved monitoring and real-time analysis. To facilitate extra control, the system supports manual and automatic modes.
The manual mode provides access to individual process variables, thereby allowing operators to have extremely close control over process parameters. The automatic mode, on the other hand, allows for complex ‘daisy chain’ recipes to be created and stored in memory. This provides the operator with the ability to build a recipe library, automate the lapping and/or polishing process and free up time to work on other tasks, safe in the knowledge that the samples will be polished to the required specification.
Safety features include industry standard door interlocks to the
deck and lower cabinet areas, which protect operators from moving/electrical
parts and work area from accidental interruptions.
Industry Standard System Architecture
Additionally, the DL4 is supplied with a fully enclosed hood and exhaust port as standard. This ensures it is suitable for processing hazardous materials such as Gallium Arsenide (GaAs) or Indium Phosphide (InP).
Product Specification
| Power Supply : | 380Vac - 415Vac, 50-60Hz 3 Phase, 32A |
| Plate Speed : | 0-160rpm |
| Plate Size : | 600mm (23.6") |
| Carrier Speed : | 10-125rpm |
| Min Slurry Flow Rate | 20ml/min |
| Max Slurry Flow Rate : | 500ml/min |
| Machine Capacity : | 48 x 2" wafers per run |
| Height : | 2020mm |
| Depth : | 990mm + Control Panel |
| Width : | 830mm |
For more information on the DL4 Polishing Machine, call us on +44 (0)1389 875444 or complete our contact form.