Logitech: Why us?

Logitech Ltd is a solution of choice for high specification surface finishing with precise geometric accuracy.  Our materials processing experts design and manufacture a range of precision sawing, lapping and polishing equipment.

The value of wafer bonding

If controlling Total Thickness Variation (TTV) is critical to your wafer thinning or polishing process; then it is imperative that the wafer be bonded to a support carrier disc (substrate) to control bond thickness consistency and dimensional accuracy.

Polishing up after Semicon West

Almost everywhere you looked at Semicon West in San Francisco this year, semiconductor manufacturers were discussing the increased complexity of the products they are now designing.

Automating the reduction of CMP consumables waste

The electronic materials industry is changing, with process complexity driving growth in the slurries and pads used in chemical-mechanical polishing (CMP) processes.