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Lapping and polishing machines by Logitech

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Logitech are specailists in all areas of materials processing - from precision cutting of geological thin sections through to lapping and polishing and chemical mechanical polishing of semiconductors.

Our experienced process engineers and development staff have mastered the ability to cut, lap and polish many different materials over the years and, as trends in the marketplace change, they are able to quickly and effortlessly use their skills to adapt processes to suit customer requirements. In summary, here are the main application areas we work in:

Semiconductors

Logitech equipment is perfect for semiconductor materials processing, particularly since most of the compounds are extremely delicate and difficult to work with - properties which Logitech lapping and polishing technology and our chemical mechanical polishing systems are specifically designed to cater for. Find out more about what we do at this semiconductor directory.

OptoElectronics

Produce substrates of precise tolerances combined with a high degree of surface polish. Typical products are:

  • Defect free face and edge polishing of substrates
  • Scratch free surface finish on all material types
  • Exacting and repeatable dimensional results

Lasers

Develop highly uniform, parallel and directionally stable laser beams with a Logitech polishing system. Significantly reduce high levels of operator involvement, whilst at the same time improving the results achievable with conventional materials processing methods.

Fibre Optics

Polish optical fibres and fibre arrays to highly precise levels in a repeatable, efficient manner that will increase productivity. Achieve highly accurate results with a defect free and damage free surface at x500 magnification using a Logitech materials processing system.

Optics

Whether for IR and polymer waveguide production or fibre optic cable polishing, our equipment ensures the highest quality results. Systems can be provided for polishing fibre arrays, arrayed waveguides, fibre bragg gratings or single / multiple optical fibres to be used in the telecommunications, internet network and MEMS markets.

Geological Sciences

Lap and polish geological thin sections down to a thickness of 10 microns or less. Significantly reduce high levels of operator involvement, whilst at the same time improving the repeatability, performance and accuracy achievable with conventional materials processing methods.

Other Applications

Flexible systems solutions allow for a diverse range of materials to be processed, lapped or polished to within exact tolerances. Examples of other materials Logitech systems are compatible with are:

  • Tooth
  • Bone
  • Otoliths
  • Metals
  • Magnetic recording heads
  • Ceramics
  • Polymers
  • Wood

Logitech - Lapping and Polishing Machines

Lapping and Polishing Systems with you in mind

Lapping and polishing machines allow you to smooth and polish the surface of any solid material to your specifications. As a global leader in materials processing and surface finishing technology, our lapping and polishing machines allow you to finish any surface to nanometer thicknesses. Whatever your needs, there is a Logitech high-precision cutting, lapping, polishing or chemical mechanical polishing solution for your business.

Logitech lapping and polishing machines aid in improving production times, researching process technologies before moving to large scale production, and increasing the accuracy and repeatability of lapping and polishing processes.

All our cutting, lapping, polishing and chemical mechanical polishing machines and equipment are delivered within a "system package". This will include the equipment and technology transfer, the provision of hands-on training and expert after sales support. We also ensure that we keep close to our research roots by continuing to develop our expertise in all aspects of materials processing.

Benefits of Logitech Lapping and Polishing to your business

Your satisfaction is our goal when providing a complete materials processing package. This is delivered through:

  • Market orientated designs
  • Precision engineered and high quality manufacturing
  • Access to in-house materials processing expertise
  • High quality after-sales support
  • Tailor made materials processing solutions

Furthermore, with a global network of appointed distributors, Logitech brings unsurpassed lapping and polishing technology and superior materials processing engineering to industries all over the world.

For more information on our cutting, lapping and polishing equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.